Demanding applications like power converters for e-mobility and renewable energy require high power DCB circuits. The key requirements for power electronics and therefore for the interconnects on DCB substrates are increased lifetime, low thermal resistance and elevated operation temperature. The Microbond Ag Interconnect mAgic product family utilizes the sintering technology to fulfi ll these challenges. mAgic materials are currently used in high volume production and demonstrate their outstanding performance in high power converters every day.
